From Tom's Hardware: Micron has disclosed another major postponement for its fabs near Clay, New York, which will pull out the facilities coming online only in late 2033, reports Syracuse, citing recently released documents from Micron. The delay, if true, marks a major struggle for a major semiconductor production cluster that was once set to start production in 2025 in the state of New York. But while the company delays its fabs near Clay, it is accelerating its Idaho fabs and reallocating CHIPS Act funding to that facility.
According to Micron's officially released draft Environmental Impact Statement (EIS) documentation back in June (see the image below for the possibly outdated schedule), the construction phase for the first fab (Fab 1) would start from late 2026 (after a year of preparations that start in late 2025, according to the company's U.S. expansion plan unveiled on July 1, 2025) and will last till the second half of 2028, or early 2029. It usually takes 12 to 24 months to fully equip a fab, depending on various factors; hence, it is reasonable to expect the first fab to start DRAM production sometime in 2030, five years later than initially expected.
The same environmental documentation pins Fab 2's construction start to the second half of 2028, Fab 3's construction start to the second half of 2033, and Fab 4's construction start to the first half of 2039. This way, the Micron Clay campus will be fully built and ramped to full production by 2045, which is five years behind schedule.
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